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Creative designs, particularly those employing advanced technologies, require High-Quality Production.
EIT maintains access to the best PC board and materials sources through a team of purchasing professionals. Generally, production orders are on a turnkey basis to take advantage of consolidated buying power and EIT qualified sources. Consignment orders that meet EIT's supplier and materials standards are welcome. All PC boards, components and mechanical assemblies are counted and inspected on receipt to insure that the production process is controlled from the start. Each customer is assigned a program manager to insure that day-to-day operations such as processing, documentation, delivery schedules, corrective actions and changes, are promptly communicated and controlled. The program manager acts as your on-site representative. The core of EIT's quality production capability is our automated placement capacity. Offering both Surface Mount (SMT) and Through Hole (PTH) placement supported by experienced assemblers, EIT can address your most demanding assembly requirements. Multiple SMT placement lines include DEK screen printing, CAM/ALOT adhesive dispenser, programmable Siemens 80F and 80S placement machines with Vision inspection, and Electrovert Convection Reflow and Wave Solder equipment. Depending on parts list and board layout, components can be placed at rates of up to 30,000 per hour. Components with dimensions as tight as 12 mil pitch QFP, 0402 passives, BGA's (ball-grid arrays), micro BGA's, CSP's (chip scale packages), and double sided mixed technology can all be programmed and placed by our equipment. The process control achieved through screen printing, Vision inspection and convection reflow assure high first pass yields resulting in high quality, quicker deliveries at a controlled cost. Our programmable Universal Through Hole equipment supports mature designs and mixed technology applications consistent with our full service approach. Both DIP and axial leaded parts are placed. Finally, an experienced team of assemblers hand places components with unique requirements or dimensions. Unique profiles are maintained to control both the reflow and wave solder processes. In-circuit test and inspection in accordance with IPC-A-610 (latest version) Class II standards assure that quality production is ready for final assembly and shipment. Final assembly capability ranges from hardware additions to full electro-mechanical assembly and "box build." Wire harness and cables are procured through EIT qualified sources or provided by the customer. From receiving through shipment strict ESD (electrostatic discharge) controls are observed. The yield from each process is monitored and results are fed back to our continuous process improvement system. Fine tuning adjustments are made to control cost and to insure the highest quality from our process. Assembler training includes both formal training sponsored by equipment and materials suppliers, IPC training, in-house training programs and specific on-the-job training. Training in component identification, solder techniques and print reading is mandatory for all assemblers and machine operators. By controlling our process, we expect that you should be able to install your assemblies without further testing or inspection. Our quality production objective is to keep our processes controlled to a Six Sigma Standard which should result in Defect Free deliveries to you. To learn more about EIT's production and procurement services, use our Contact form.
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EIT, Inc., 108 Carpenter Drive, Sterling, VA 20164 Questions, problems, comments? Contact webmaster@eitinc.com
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